Alliance Memory, Inc.
Imej mungkin representasi.
Lihat spesifikasi untuk butiran produk.
AS4C128M32MD2A-18BINTR
Lihat Butiran Helaian data

AS4C128M32MD2A-18BINTR

Basic Information Overview

  • Category: Integrated Circuit (IC)
  • Use: Memory module
  • Characteristics:
    • High-density memory chip
    • Low power consumption
    • Fast data transfer rate
  • Package: BGA (Ball Grid Array)
  • Essence: Non-volatile memory storage
  • Packaging/Quantity: Individually packaged, quantity varies based on customer requirements

Specifications

  • Model: AS4C128M32MD2A-18BINTR
  • Organization: 128 Meg x 32
  • Speed: 18 ns
  • Voltage: 3.3V
  • Interface: Synchronous
  • Operating Temperature: -40°C to +85°C

Detailed Pin Configuration

The AS4C128M32MD2A-18BINTR chip has a total of 144 pins. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDD | Power supply voltage | | 2 | VDDQ | Power supply voltage for I/O buffers | | 3 | DQ0 | Data input/output bit 0 | | 4 | DQ1 | Data input/output bit 1 | | ... | ... | ... | | 143 | DQ31 | Data input/output bit 31 | | 144 | VSS | Ground |

Functional Features

  • High-density memory storage: The AS4C128M32MD2A-18BINTR chip offers a large capacity of 128 Megabytes, allowing for the storage of a significant amount of data.
  • Low power consumption: The chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices.
  • Fast data transfer rate: With a speed of 18 ns, the chip enables quick and efficient data transfer between the memory module and the connected device.

Advantages and Disadvantages

Advantages

  • High storage capacity
  • Low power consumption
  • Fast data transfer rate

Disadvantages

  • Limited compatibility with certain devices due to its specific pin configuration
  • Relatively higher cost compared to lower-capacity memory modules

Working Principles

The AS4C128M32MD2A-18BINTR chip utilizes synchronous interface technology to communicate with the host device. It stores data in non-volatile memory cells, ensuring that the stored information is retained even when power is disconnected. The chip operates at a voltage of 3.3V and transfers data at a high speed of 18 ns.

Detailed Application Field Plans

The AS4C128M32MD2A-18BINTR chip finds application in various fields, including: 1. Computer systems: Used as main memory in desktops, laptops, and servers. 2. Networking equipment: Integrated into routers, switches, and network storage devices for data buffering and caching. 3. Consumer electronics: Utilized in gaming consoles, set-top boxes, and digital televisions for storing firmware, software, and multimedia content. 4. Industrial automation: Employed in control systems, PLCs (Programmable Logic Controllers), and robotics for data storage and processing.

Detailed and Complete Alternative Models

  1. AS4C128M32MD2A-18BCNTR
  2. AS4C128M32MD2A-18BCINTR
  3. AS4C128M32MD2A-18BCNINTR
  4. AS4C128M32MD2A-18BCNINTRA

These alternative models offer similar specifications and functionality to the AS4C128M32MD2A-18BINTR chip, providing options for different customer requirements.

Word count: 389

Senaraikan 10 soalan dan jawapan biasa yang berkaitan dengan aplikasi AS4C128M32MD2A-18BINTR dalam penyelesaian teknikal

Sure! Here are 10 common questions and answers related to the application of AS4C128M32MD2A-18BINTR in technical solutions:

  1. Q: What is the AS4C128M32MD2A-18BINTR? A: The AS4C128M32MD2A-18BINTR is a specific type of memory chip commonly used in technical solutions.

  2. Q: What is the capacity of the AS4C128M32MD2A-18BINTR? A: The AS4C128M32MD2A-18BINTR has a capacity of 128 megabits (Mb) or 16 megabytes (MB).

  3. Q: What is the speed rating of the AS4C128M32MD2A-18BINTR? A: The AS4C128M32MD2A-18BINTR has a speed rating of 18 nanoseconds (ns).

  4. Q: What is the voltage requirement for the AS4C128M32MD2A-18BINTR? A: The AS4C128M32MD2A-18BINTR operates at a voltage of 3.3 volts (V).

  5. Q: What is the pin configuration of the AS4C128M32MD2A-18BINTR? A: The AS4C128M32MD2A-18BINTR has a 90-ball FBGA (Fine-Pitch Ball Grid Array) package with a specific pin configuration.

  6. Q: Can the AS4C128M32MD2A-18BINTR be used in embedded systems? A: Yes, the AS4C128M32MD2A-18BINTR is commonly used in embedded systems due to its compact size and high capacity.

  7. Q: What is the operating temperature range of the AS4C128M32MD2A-18BINTR? A: The AS4C128M32MD2A-18BINTR has an operating temperature range of -40°C to +85°C.

  8. Q: Is the AS4C128M32MD2A-18BINTR compatible with DDR3 memory interfaces? A: Yes, the AS4C128M32MD2A-18BINTR is designed to be compatible with DDR3 memory interfaces.

  9. Q: Can the AS4C128M32MD2A-18BINTR be used in high-performance computing applications? A: Yes, the AS4C128M32MD2A-18BINTR is suitable for use in high-performance computing applications due to its speed and capacity.

  10. Q: Are there any specific design considerations when using the AS4C128M32MD2A-18BINTR? A: It is important to ensure proper power supply and signal integrity when designing with the AS4C128M32MD2A-18BINTR, as well as following the manufacturer's guidelines for layout and routing.

Please note that the answers provided here are general and may vary depending on the specific requirements and application of the AS4C128M32MD2A-18BINTR in a technical solution.