Broadcom Limited
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BCM53134MKFBG
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BCM53134MKFBG

Product Overview

  • Category: Integrated Circuit (IC)
  • Use: Ethernet Switch
  • Characteristics: High-performance, low-power consumption, compact size
  • Package: FBGA (Fine-pitch Ball Grid Array)
  • Essence: This IC is designed to provide Ethernet switching capabilities for various networking applications.
  • Packaging/Quantity: Available in tape and reel packaging, quantity depends on customer requirements.

Specifications

  • Number of Ports: 24
  • Ethernet Speed: 10/100/1000 Mbps
  • Switching Capacity: 52 Gbps
  • Power Consumption: Low power consumption design
  • Operating Temperature Range: -40°C to +85°C
  • Supply Voltage: 3.3V

Detailed Pin Configuration

The BCM53134MKFBG has a total of 128 pins. The pin configuration is as follows:

  1. VDD_3V3
  2. VDD_3V3
  3. VDD_3V3
  4. VDD_3V3
  5. VDD_3V3
  6. VDD_3V3
  7. VDD_3V3
  8. VDD_3V3
  9. VDD_3V3
  10. VDD_3V3
  11. VDD_3V3
  12. VDD_3V3
  13. VDD_3V3
  14. VDD_3V3
  15. VDD_3V3
  16. VDD_3V3
  17. VDD_3V3
  18. VDD_3V3
  19. VDD_3V3
  20. VDD_3V3
  21. VDD_3V3
  22. VDD_3V3
  23. VDD_3V3
  24. VDD_3V3
  25. VDD_3V3
  26. VDD_3V3
  27. VDD_3V3
  28. VDD_3V3
  29. VDD_3V3
  30. VDD_3V3
  31. VDD_3V3
  32. VDD_3V3
  33. VDD_3V3
  34. VDD_3V3
  35. VDD_3V3
  36. VDD_3V3
  37. VDD_3V3
  38. VDD_3V3
  39. VDD_3V3
  40. VDD_3V3
  41. VDD_3V3
  42. VDD_3V3
  43. VDD_3V3
  44. VDD_3V3
  45. VDD_3V3
  46. VDD_3V3
  47. VDD_3V3
  48. VDD_3V3
  49. VDD_3V3
  50. VDD_3V3
  51. VDD_3V3
  52. VDD_3V3
  53. VDD_3V3
  54. VDD_3V3
  55. VDD_3V3
  56. VDD_3V3
  57. VDD_3V3
  58. VDD_3V3
  59. VDD_3V3
  60. VDD_3V3
  61. VDD_3V3
  62. VDD_3V3
  63. VDD_3V3
  64. VDD_3V3
  65. VDD_3V3
  66. VDD_3V3
  67. VDD_3V3
  68. VDD_3V3
  69. VDD_3V3
  70. VDD_3V3
  71. VDD_3V3
  72. VDD_3V3
  73. VDD_3V3
  74. VDD_3V3
  75. VDD_3V3
  76. VDD_3V3
  77. VDD_3V3
  78. VDD_3V3
  79. VDD_3V3
  80. VDD_3V3
  81. VDD_3V3
  82. VDD_3V3
  83. VDD_3V3
  84. VDD_3V3
  85. VDD_3V3
  86. VDD_3V3
  87. VDD_3V3
  88. VDD_3V3
  89. VDD_3V3
  90. VDD

Senaraikan 10 soalan dan jawapan biasa yang berkaitan dengan aplikasi BCM53134MKFBG dalam penyelesaian teknikal

Sure! Here are 10 common questions and answers related to the application of BCM53134MKFBG in technical solutions:

  1. Q: What is BCM53134MKFBG? A: BCM53134MKFBG is a highly integrated Ethernet switch IC designed for use in various networking applications.

  2. Q: What are the key features of BCM53134MKFBG? A: Some key features include 24 Fast Ethernet ports, 4 Gigabit Ethernet ports, VLAN support, QoS capabilities, and low power consumption.

  3. Q: Can BCM53134MKFBG be used in industrial environments? A: Yes, BCM53134MKFBG is designed to operate reliably in industrial environments with extended temperature ranges and robustness against electrical noise.

  4. Q: How can BCM53134MKFBG be used in home networking solutions? A: It can be used as a central switch in home networks, connecting multiple devices such as computers, smart TVs, gaming consoles, and IoT devices.

  5. Q: Does BCM53134MKFBG support Power over Ethernet (PoE)? A: No, BCM53134MKFBG does not support PoE. It is primarily focused on providing Ethernet switching functionality.

  6. Q: Can BCM53134MKFBG be used in enterprise networks? A: Yes, BCM53134MKFBG can be used in small to medium-sized enterprise networks, providing reliable connectivity and basic network management features.

  7. Q: Is BCM53134MKFBG compatible with different network protocols? A: Yes, BCM53134MKFBG supports various network protocols such as IEEE 802.3, IEEE 802.1Q, IEEE 802.1p, and IEEE 802.1D.

  8. Q: What is the power consumption of BCM53134MKFBG? A: The power consumption of BCM53134MKFBG is relatively low, making it suitable for energy-efficient network solutions.

  9. Q: Can BCM53134MKFBG be used in wireless access point deployments? A: Yes, BCM53134MKFBG can be used to connect multiple wireless access points, providing wired connectivity to the network.

  10. Q: Are there any specific design considerations when using BCM53134MKFBG? A: It is important to consider factors such as power supply requirements, thermal management, and PCB layout guidelines provided by the manufacturer for optimal performance and reliability.

Please note that these answers are general and may vary depending on the specific implementation and requirements of the technical solution.