8N3SV75FC-0108CDI

Product Overview

Category

The 8N3SV75FC-0108CDI belongs to the category of integrated circuits (ICs).

Use

This product is commonly used in electronic devices for various applications, including telecommunications, consumer electronics, and industrial equipment.

Characteristics

• Integrated circuit with advanced functionality
• High performance and reliability
• Compact size for space-constrained designs
• Low power consumption
• Wide operating temperature range

Package

The 8N3SV75FC-0108CDI is available in a small form factor package, suitable for surface mount technology (SMT) assembly.

Essence

This integrated circuit serves as a key component in electronic systems, providing essential functions such as signal processing, amplification, or control.

Packaging/Quantity

The 8N3SV75FC-0108CDI is typically packaged in reels or trays, depending on the manufacturer's specifications. The quantity per package may vary, but it is commonly available in quantities of 1000 units.

Specifications

• Model: 8N3SV75FC-0108CDI
• Operating Voltage: 3.3V
• Operating Temperature Range: -40°C to +85°C
• Input/Output Interface: SPI (Serial Peripheral Interface)
• Package Type: QFN (Quad Flat No-Lead)
• Dimensions: 5mm x 5mm

Detailed Pin Configuration

The 8N3SV75FC-0108CDI has a total of 16 pins arranged as follows:

1. VDD: Power supply input
2. GND: Ground reference
3. SCLK: Serial clock input
4. MOSI: Master output, slave input
5. MISO: Master input, slave output
6. CS: Chip select input
7. INT: Interrupt output
8. A0: Address bit 0
9. A1: Address bit 1
10. A2: Address bit 2
11. A3: Address bit 3
12. D0: Data bit 0
13. D1: Data bit 1
14. D2: Data bit 2
15. D3: Data bit 3
16. RESET: Reset input

Functional Features

• High-speed data transfer using SPI interface
• Configurable address and data bits for flexible operation
• Interrupt output for event-driven applications
• Reset input for system initialization
• Low power consumption in standby mode
• Built-in protection features for enhanced reliability

Advantages and Disadvantages

Advantages

• Compact size allows for integration into space-constrained designs
• Wide operating temperature range enables usage in various environments
• High performance and reliability ensure consistent operation
• Flexible configuration options for different application requirements

Disadvantages

• Requires knowledge of SPI interface for proper utilization
• Limited number of address and data bits may restrict certain applications
• Sensitive to electrostatic discharge (ESD) and requires proper handling during assembly

Working Principles

The 8N3SV75FC-0108CDI operates based on the principles of digital signal processing and control. It receives input signals through the SPI interface, processes them according to the configured settings, and provides the desired output or control signals. The integrated circuit utilizes internal logic circuits and memory elements to perform its functions accurately and efficiently.

Detailed Application Field Plans

The 8N3SV75FC-0108CDI finds applications in various fields, including:

1. Telecommunications: Used in network equipment, routers, and switches for signal processing and control.
2. Consumer Electronics: Incorporated into audio/video devices, gaming consoles, and smart home systems for data handling and control functions.
3. Industrial Equipment: Employed in automation systems, motor control units, and measurement instruments for precise control and signal processing.

Detailed and Complete Alternative Models

1. 8N3SV75FC-0208CDI: Similar to the 8N3SV75FC-0108CDI but with extended address and data bit options.
2. 8N3SV75FC-0108CDX: Variant with additional features such as built-in memory or enhanced protection mechanisms.
3. 8N3SV75FC-0108CDP: Package variant with different pin configuration suitable for specific assembly requirements.

These alternative models offer similar functionality and can be considered based on specific project needs.

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