EP1S30F780I6N

Product Overview

• Category: Integrated Circuit (IC)
• Use: Programmable Logic Device (PLD)
• Characteristics: High-performance, low-power consumption
• Package: 780-pin FineLine BGA package
• Essence: Field-Programmable Gate Array (FPGA)
• Packaging/Quantity: Single unit

Specifications

• Technology: 0.18μm CMOS
• Logic Elements: 29,440
• Embedded Memory: 1,152 Kbits
• Maximum User I/Os: 622
• Operating Voltage: 3.3V
• Operating Temperature: -40°C to +100°C
• Speed Grade: 6

Detailed Pin Configuration

The EP1S30F780I6N has a total of 780 pins, each serving a specific purpose in the circuit. The pin configuration is as follows:

• Pins 1-100: Power and Ground Pins
• Pins 101-200: Input/Output Pins
• Pins 201-300: Clock Pins
• Pins 301-400: Configuration Pins
• Pins 401-500: Special Function Pins
• Pins 501-600: Dedicated Input/Output Pins
• Pins 601-700: Unused Pins
• Pins 701-780: Reserved for Future Use

Functional Features

• High-speed performance with advanced CMOS technology
• Low power consumption for energy-efficient operation
• Large number of logic elements for complex designs
• Ample embedded memory for data storage
• Extensive user I/Os for versatile connectivity
• Wide operating temperature range for various environments
• FineLine BGA package for compact integration

Advantages and Disadvantages

Advantages

• Versatile programmability for custom designs
• High-speed operation for time-critical applications
• Low power consumption for energy efficiency
• Ample logic elements and memory for complex designs
• Wide operating temperature range for diverse environments

Disadvantages

• Limited number of I/O pins compared to some alternatives
• Relatively high cost compared to simpler ICs
• Requires specialized knowledge for programming and utilization

Working Principles

The EP1S30F780I6N is a Field-Programmable Gate Array (FPGA) that utilizes CMOS technology. It consists of an array of configurable logic blocks interconnected through programmable interconnects. The device can be programmed to implement various digital circuits, allowing for flexible and customizable designs.

Detailed Application Field Plans

The EP1S30F780I6N finds applications in various fields, including:

1. Telecommunications: Used in network equipment for data processing and routing.
2. Industrial Automation: Employed in control systems for process automation and monitoring.
3. Automotive Electronics: Integrated into automotive systems for advanced driver assistance and infotainment.
4. Aerospace and Defense: Utilized in avionics and defense systems for signal processing and control.
5. Consumer Electronics: Incorporated into multimedia devices for enhanced functionality and performance.

Detailed and Complete Alternative Models

1. EP1S10F484C7N: Smaller FPGA with 10,320 logic elements and 484-pin package.
2. EP1S60F1020C7N: Larger FPGA with 59,520 logic elements and 1020-pin package.
3. EP1S80F1508C7N: Higher-end FPGA with 79,040 logic elements and 1508-pin package.
4. EP1S120F780C7N: FPGA with increased logic capacity (116,640 elements) and 780-pin package.

These alternative models provide different options based on logic capacity, pin count, and package size, catering to diverse design requirements.

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