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IS43DR82560B-25EBL-TR
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IS43DR82560B-25EBL-TR

Product Overview

Category

IS43DR82560B-25EBL-TR belongs to the category of dynamic random-access memory (DRAM) products.

Use

This product is primarily used for high-performance computing, networking, and communication applications.

Characteristics

  • High-speed operation
  • Low power consumption
  • Large storage capacity
  • Reliable performance

Package

IS43DR82560B-25EBL-TR is available in a compact and industry-standard package.

Essence

The essence of this product lies in its ability to provide fast and efficient data storage and retrieval for various electronic devices.

Packaging/Quantity

IS43DR82560B-25EBL-TR is typically packaged in reels and is available in varying quantities depending on customer requirements.

Specifications

  • Memory Type: DDR3 SDRAM
  • Capacity: 256 Megabits (32 Megabytes)
  • Organization: 8 Meg x 32
  • Operating Voltage: 1.5V
  • Speed Grade: 800 MHz
  • Access Time: 25 ns
  • Interface: Parallel

Detailed Pin Configuration

The pin configuration of IS43DR82560B-25EBL-TR is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. WE#
  12. CAS#
  13. RAS#
  14. A0
  15. A1
  16. A2
  17. A3
  18. A4
  19. A5
  20. A6
  21. A7
  22. A8
  23. A9
  24. A10
  25. A11
  26. A12
  27. A13
  28. A14
  29. A15
  30. VSS
  31. CLK
  32. CKE#
  33. CS#
  34. BA0
  35. BA1
  36. VDD

Functional Features

  • High-speed data transfer
  • Burst mode operation
  • Auto-refresh and self-refresh modes
  • On-die termination (ODT) for improved signal integrity
  • Low-power standby mode

Advantages and Disadvantages

Advantages

  • Fast and efficient data access
  • Large storage capacity
  • Low power consumption
  • Reliable performance

Disadvantages

  • Limited compatibility with older devices that do not support DDR3 SDRAM

Working Principles

IS43DR82560B-25EBL-TR operates based on the principles of dynamic random-access memory. It stores data in capacitors within each memory cell, which must be periodically refreshed to maintain the stored information.

Detailed Application Field Plans

IS43DR82560B-25EBL-TR is suitable for a wide range of applications, including: - High-performance computing systems - Networking equipment - Communication devices - Industrial automation systems - Embedded systems

Detailed and Complete Alternative Models

Some alternative models to IS43DR82560B-25EBL-TR include: - IS43DR82560C-25EBL-TR - IS43DR82560D-25EBL-TR - IS43DR82560E-25EBL-TR - IS43DR82560F-25EBL-TR

These alternative models offer similar specifications and functionality, providing customers with flexibility in choosing the most suitable option for their specific requirements.

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Senaraikan 10 soalan dan jawapan biasa yang berkaitan dengan aplikasi IS43DR82560B-25EBL-TR dalam penyelesaian teknikal

Sure! Here are 10 common questions and answers related to the application of IS43DR82560B-25EBL-TR in technical solutions:

  1. Question: What is the IS43DR82560B-25EBL-TR?
    Answer: The IS43DR82560B-25EBL-TR is a specific model of DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip.

  2. Question: What is the capacity of the IS43DR82560B-25EBL-TR?
    Answer: The IS43DR82560B-25EBL-TR has a capacity of 256 Megabits (Mb), which is equivalent to 32 Megabytes (MB).

  3. Question: What is the operating voltage range for this chip?
    Answer: The IS43DR82560B-25EBL-TR operates at a voltage range of 1.425V to 1.575V.

  4. Question: What is the maximum clock frequency supported by this chip?
    Answer: The IS43DR82560B-25EBL-TR supports a maximum clock frequency of 400 MHz.

  5. Question: Can this chip be used in mobile devices?
    Answer: Yes, the IS43DR82560B-25EBL-TR is suitable for use in mobile devices such as smartphones and tablets.

  6. Question: What are the typical applications of this chip?
    Answer: This chip is commonly used in various technical solutions, including embedded systems, networking equipment, industrial automation, and telecommunications.

  7. Question: Does this chip support ECC (Error Correction Code)?
    Answer: No, the IS43DR82560B-25EBL-TR does not support ECC. It is a non-ECC memory chip.

  8. Question: What is the package type for this chip?
    Answer: The IS43DR82560B-25EBL-TR comes in a 96-ball BGA (Ball Grid Array) package.

  9. Question: Can this chip be used in automotive applications?
    Answer: Yes, the IS43DR82560B-25EBL-TR is suitable for use in automotive applications that require reliable memory solutions.

  10. Question: Is this chip RoHS (Restriction of Hazardous Substances) compliant?
    Answer: Yes, the IS43DR82560B-25EBL-TR is RoHS compliant, ensuring it meets environmental standards.

Please note that these answers are based on general information about the IS43DR82560B-25EBL-TR and may vary depending on specific requirements and use cases.