LCMXO2-7000HE-4FTG256C

Product Overview

Category

The LCMXO2-7000HE-4FTG256C belongs to the category of Field-Programmable Gate Arrays (FPGAs).

Use

FPGAs are integrated circuits that can be programmed and reprogrammed to perform various digital functions. The LCMXO2-7000HE-4FTG256C is specifically designed for applications requiring low power consumption and high performance.

Characteristics

• Low power consumption: The LCMXO2-7000HE-4FTG256C is optimized for low power operation, making it suitable for battery-powered devices.
• High performance: With a high logic density and fast processing capabilities, this FPGA can handle complex tasks efficiently.
• Small package size: The LCMXO2-7000HE-4FTG256C comes in a compact 256-ball Fine-Pitch Ball Grid Array (FBGA) package, allowing for space-efficient designs.
• Versatile functionality: It offers a wide range of programmable features, including configurable logic blocks, embedded memory, and I/O interfaces.

Packaging/Quantity

The LCMXO2-7000HE-4FTG256C is typically sold in reels or trays, with each reel containing a specific quantity of FPGAs. The exact packaging and quantity may vary depending on the supplier.

Specifications

• Logic Elements: 7,000
• Look-Up Tables (LUTs): 4,500
• Flip-Flops: 9,000
• Block RAM: 270 Kbits
• Maximum User I/Os: 173
• Operating Voltage: 1.2V
• Package Type: FBGA
• Package Pins: 256
• Temperature Range: -40°C to 100°C

Detailed Pin Configuration

The LCMXO2-7000HE-4FTG256C has a total of 256 pins, each serving a specific purpose. The pin configuration includes input/output pins, power supply pins, and configuration pins. For a detailed pinout diagram and description, refer to the manufacturer's datasheet.

Functional Features

• Configurable Logic Blocks (CLBs): The FPGA contains multiple CLBs that can be programmed to implement various logic functions.
• Embedded Memory: It includes dedicated memory blocks for storing data during operation.
• I/O Interfaces: The LCMXO2-7000HE-4FTG256C supports various communication protocols, such as UART, SPI, and I2C, enabling seamless integration with external devices.
• Clock Management: It provides flexible clocking options, including PLLs and global clocks, to synchronize different parts of the design.

Advantages and Disadvantages

Advantages

• Low power consumption makes it suitable for battery-powered applications.
• High performance allows for efficient execution of complex tasks.
• Compact package size enables space-efficient designs.
• Versatile functionality provides flexibility in implementing different digital functions.

Disadvantages

• Limited number of user I/Os may restrict connectivity options in certain applications.
• Higher cost compared to other programmable logic devices.
• Steeper learning curve for programming and configuring the FPGA.

Working Principles

The LCMXO2-7000HE-4FTG256C operates based on the principles of reconfigurable computing. It consists of configurable logic blocks interconnected through programmable routing resources. The FPGA is programmed using a Hardware Description Language (HDL) to define the desired functionality. During operation, the FPGA dynamically configures its internal connections to implement the specified logic functions.

Detailed Application Field Plans

The LCMXO2-7000HE-4FTG256C finds applications in various fields, including:

1. Embedded Systems: It can be used to implement control and communication interfaces in embedded systems.
2. Industrial Automation: The FPGA's high performance and flexibility make it suitable for industrial automation tasks, such as motor control and sensor interfacing.
3. Communications: It can be utilized in networking equipment, enabling the implementation of custom protocols and data processing.
4. Consumer Electronics: The FPGA can enhance the functionality of consumer electronic devices, such as smart home systems and multimedia devices.

Detailed and Complete Alternative Models

• LCMXO2-1200ZE-1TG144C
• LCMXO2-2000HC-4BG256C
• LCMXO2-4000HE-5MG132C
• LCMXO2-7000HC-4TG100C

These alternative models offer different logic capacities, package types, and pin configurations, providing options to suit specific project requirements.

Note: The content provided above is a sample entry and may not reflect actual specifications or information about the mentioned product.