MX25R2035FBDIL0

Product Overview

• Category: Integrated Circuit (IC)
• Use: Non-volatile Memory
• Characteristics:
  • High-speed data transfer
  • Low power consumption
  • Large storage capacity
• Package: FBGA (Fine-pitch Ball Grid Array)
• Essence: Flash memory chip
• Packaging/Quantity: Individually packaged, quantity varies based on manufacturer's specifications

Specifications

• Memory Type: Serial NOR Flash
• Density: 32Mb (4MB)
• Interface: SPI (Serial Peripheral Interface)
• Operating Voltage: 2.7V - 3.6V
• Operating Temperature: -40°C to +85°C
• Data Retention: Up to 20 years
• Programming Time: Typically less than 1 second per sector
• Erase Time: Typically less than 0.1 second per sector

Detailed Pin Configuration

The MX25R2035FBDIL0 has a total of 8 pins, which are as follows:

1. VCC: Power supply voltage input
2. GND: Ground reference
3. HOLD: Hold input for suspending ongoing operations
4. WP: Write Protect input for protecting the memory content
5. SIO0: Serial Data Input/Output line
6. SIO1: Serial Data Output line in Dual I/O mode
7. SIO2: Serial Data Input line in Quad I/O mode
8. SIO3: Serial Data Output line in Quad I/O mode

Functional Features

• High-speed data transfer up to 104MHz
• Flexible read and write operations
• Sector erase and byte programming capabilities
• Software and hardware protection mechanisms
• Deep power-down mode for ultra-low power consumption
• Fast wake-up time for instant access

Advantages and Disadvantages

Advantages: - High-speed data transfer enables quick read/write operations - Low power consumption prolongs battery life in portable devices - Large storage capacity accommodates extensive data storage needs - Flexible protection mechanisms ensure data security

Disadvantages: - Limited density compared to higher-capacity memory chips - Relatively higher cost per megabyte compared to other memory technologies

Working Principles

The MX25R2035FBDIL0 is based on the Serial NOR Flash memory technology. It utilizes a Serial Peripheral Interface (SPI) for communication with the host microcontroller or system. The memory chip stores data in non-volatile memory cells, which retain information even when power is removed. The SPI interface allows for high-speed data transfer between the memory and the host device.

Detailed Application Field Plans

The MX25R2035FBDIL0 finds applications in various fields, including but not limited to:

1. Consumer Electronics:

   • Smartphones
   • Tablets
   • Digital cameras
   • Gaming consoles

2. Automotive:

   • Infotainment systems
   • Instrument clusters
   • Advanced driver-assistance systems (ADAS)

3. Industrial:

   • Internet of Things (IoT) devices
   • Industrial automation systems
   • Data loggers

4. Communication:

   • Routers
   • Modems
   • Network switches

Detailed and Complete Alternative Models

1. MX25R8035FBDIL0: 8Mb (1MB) density variant
2. MX25R1635FBDIL0: 16Mb (2MB) density variant
3. MX25R3235FBDIL0: 32Mb (4MB) density variant
4. MX25R6435FBDIL0: 64Mb (8MB) density variant
5. MX25R12835FBDIL0: 128Mb (16MB) density variant

These alternative models offer different memory densities to cater to various storage requirements.

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