QD Devices Inc.
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ADCMP607BCPZ-R2
Helaian data

ADCMP607BCPZ-R2

IC COMP TTL/CMOS 1CHAN 12-LFCSP
Nombor Bahagian
ADCMP607BCPZ-R2
Pengeluar/Jenama
QD Devices Inc.
Siri
-
Status Bahagian
Discontinued at Digi-Key
Pembungkusan
Cut Tape (CT)
Suhu Operasi
-40°C ~ 125°C
Jenis Pemasangan
Surface Mount
Pakej / Kes
12-WFQFN Exposed Pad, CSP
taip
with Latch
Jenis Output
CML, Complementary, Rail-to-Rail
Pakej Peranti Pembekal
12-LFCSP-WQ (3x3)
Bilangan Elemen
1
Voltan - Bekalan, Tunggal/Dwi (�)
2.5 V ~ 5.5 V
Voltan - Input Offset (Maks)
5mV @ 2.5V
Semasa - Bias Input (Maks)
5µA @ 2.5V
Semasa - Output (Jenis)
50mA
Semasa - Diam (Maks)
1.5mA
CMRR, PSRR (Jenis)
50dB CMRR, 50dB PSRR
Kelewatan Pembiakan (Maks)
2.1ns
Histeresis
100µV
Minta Sebut Harga
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Kata kunci daripada ADCMP607BCPZ-R2
ADCMP607BCPZ-R2 Komponen elektronik
ADCMP607BCPZ-R2 Jualan
ADCMP607BCPZ-R2 Pembekal
ADCMP607BCPZ-R2 Pengedar
ADCMP607BCPZ-R2 Jadual data
ADCMP607BCPZ-R2 Foto
ADCMP607BCPZ-R2 harga
ADCMP607BCPZ-R2 Tawaran
ADCMP607BCPZ-R2 Harga terendah
ADCMP607BCPZ-R2 Cari
ADCMP607BCPZ-R2 Membeli
ADCMP607BCPZ-R2 Chip