TE Connectivity Passive Product
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HSA258K2J
Helaian data

HSA258K2J

RES CHAS MNT 8.2K OHM 5% 25W
Nombor Bahagian
HSA258K2J
Pengeluar/Jenama
TE Connectivity Passive Product
Siri
HS, CGS
Status Bahagian
Active
Pembungkusan
Bulk
Suhu Operasi
-55°C ~ 200°C
Saiz / Dimensi
1.142" L x 1.102" W (29.00mm x 28.00mm)
Ketinggian - Duduk (Maks)
0.591" (15.00mm)
Toleransi
±5%
Pekali Suhu
±30ppm/°C
ciri-ciri
-
Kadar kegagalan
-
Pakej / Kes
Axial, Box
Gaya Utama
Solder Lugs
Ciri Pemasangan
Flanges
Kuasa (Watts)
25W
Rintangan
8.2 kOhms
Komposisi
Wirewound
Salutan, Jenis Perumahan
Aluminum
Minta Sebut Harga
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Dalam stok 20403 PCS
Maklumat perhubungan
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RES CHAS MNT 16 OHM 1% 25W
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RES CHAS MNT 16 OHM 1% 25W
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RES CHAS MNT 1.2K OHM 5% 25W
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Kata kunci daripada HSA258K2J
HSA258K2J Komponen elektronik
HSA258K2J Jualan
HSA258K2J Pembekal
HSA258K2J Pengedar
HSA258K2J Jadual data
HSA258K2J Foto
HSA258K2J harga
HSA258K2J Tawaran
HSA258K2J Harga terendah
HSA258K2J Cari
HSA258K2J Membeli
HSA258K2J Chip